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MICROWAVE BEAM-LEAD TRANSISTOR.TSURUMIYA K; HIRANO Y; TAKAHASHI A et al.1974; FUJITSU SCI. TECH. J.; JAP.; DA. 1974; VOL. 10; NO 2; PP. 105-124; BIBL. 7 REF.Article

TECHNOLOGIE DES ELEMENTS CAPACITIFS A CONNEXION DEPASSANTEHALAS I; KAMPA J.1977; PRACE OSRODKA BADAWCZO-ROZWOJOW-ELEKTRON. PROZNIOW.; POLOGNE; DA. 1977; VOL. 5; NO 10; PP. 53-59; ABS. ANGL. RUSSE; BIBL. 7 REF.Article

A TWO-TOOL, PARALLEL-GAP, BEAM-LEAD BONDER FOR HYBRID CIRCUITSSCHELHORN RL.1972; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1972; VOL. 12; NO 10; PP. 145-151 (5 P.)Serial Issue

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LE "BEAM-LEAD": UNE FORMULE CONTROVERSEE BIEN QUE TRES ATTRAYANTE.LE CAIN M.1976; ELECTRON. MICROELECTRON. INDUSTR.; FR.; DA. 1976; NO 217; PP. 28-30Article

PACKAGING THE FAST, HOT ICS1973; E.E./SYST. ENGNG TODAY; U.S.A.; DA. 1973; VOL. 32; NO 3; PP. 48-50Serial Issue

PACKAGE DEVELOPMENT FOR A LARGE MULTI-CHIP ARRAY.CLEFORD AP; PAYNE JR.1974; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1974; VOL. 14; NO 9; PP. 47-54 (4P.); BIBL. 6 REF.Article

PREDICTING THE THERMAL PERFORMANCES OF BEAM-LEADED ICSPRESTON SB.1972; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1972; VOL. 12; NO 10; PP. 69-82 (8 P.); BIBL. 3 REF.Serial Issue

CONVERSION LOSS OF AN MIC BALANCED MIXER: CALCULATION AND MEASUREMENTSSCHUEPPERT B.1982; ELECTRON. LETT.; ISSN 0013-5194; GBR; DA. 1982; VOL. 18; NO 19; PP. 823-824; BIBL. 2 REF.Article

DOMINANT DIFFUSION MECHANISM IN RHSI FORMATIONMGBENU EN.1978; THIN SOLID FILMS; NLD; DA. 1978; VOL. 50; PP. L13-L16; BIBL. 12 REF.Article

OXYGEN EMBRITTLEMENT OF COPPER LEADS.PANOUSIS NT; WONSIEWICZ BC; CONDRA LW et al.1977; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1977; VOL. 13; NO 2; PP. 127-132; BIBL. 11 REF.Article

DETECTION OF SPUTTER CONTAMINATION AND SPUTTER ETCH RESIDUE BY ION MICROPROBE ANALYSISANDREWS JM; KATE LE; COLBY JW et al.1980; THIN SOLID FILMS; ISSN 0040-6090; CHE; DA. 1980; VOL. 67; NO 2; PP. 325-340; BIBL. 20 REF.Article

MILLIMETER-WAVE MIXERS FORGE AHEAD WITH GUNN AND BEAM-LEAD DIODES1979; MICROWAVES; USA; DA. 1979; VOL. 18; NO 4; PP. 25-26Article

METHODS FOR PRODUCING SOLDERABLE, RIGID TERMINALS ON FLEXIBLE PRINTED CIRCUITS.JEAN LH.1978; INSULAT. CIRCUITS; U.S.A.; DA. 1978; VOL. 24; NO 2; PP. 45-47Article

CHIPFUEGEN-EIN UEBERBLICK. = ASSEMBLAGE DE PUCES-APERCULABS J; SCHEEL W.1978; NACHR.-TECH., ELEKTRON.; DDR; DA. 1978; VOL. 28; NO 7; PP. 284-287; ABS. RUS/ENG; BIBL. 24 REF.Article

A HIGH SPEED ECL MULTIPLEXER IN BEAM LEAD, HYBRID TECHNOLOGY.COUGHLIN JB; HUGHES JB; WATTS RS et al.1977; ELECTROCOMPON. SCI. TECHNOL.; G.B.; DA. 1977; VOL. 4; NO 3-4; PP. 185-191; BIBL. 4 REF.Article

FAILURE MODES OF BEAM-LEAD SEMICONDUCTORS IN THIN-FILM HYBRID MICROCIRCUITS.SWAFFORD JH.1976; I.E.E.E. TRANS. PARTS HYBR. PACKAG.; U.S.A.; DA. 1976; VOL. 12; NO 4; PP. 298-304; BIBL. 12 REF.Article

THE EFFECT OF SOME COMPOSITE STRUCTURES ON THE THERMAL RESISTANCE OF SUBSTRATES AND INTERGRATED CIRCUIT CHIPS = L'EFFET DE CERTAINES STRUCTURES COMPOSITES SUR LA RESISTANCE THERMIQUE DE SUBSTRATS ET DE PAILLETTES DE CIRCUITS INTEGRESELLISON GN.1973; I.E.E.E. TRANS. ELECTRON DEVICES; U.S.A.; DA. 1973; VOL. 20; NO 3; PP. 233-238; BIBL. 4 REF.Serial Issue

BEAM-LEAD PLATED HEAT SINK GAAS IMPATT: I. PERFORMANCE.DILORENZO JV; NIEHAUS WC; VELEBIR JR JR et al.1975; I.E.E.E. TRANS. ELECTRON DEVICES; U.S.A.; DA. 1975; VOL. 22; NO 8; PP. 509-514; BIBL. 21 REF.Article

DEVELOPMENT OF NTL LSI AND ITS APPLICATION TO INFORMATION PROCESSOR = DEVELOPPEMENT DE L'INTEGRATION A GRANDE ECHELLE UTILISANT UNE LOGIQUE SANS SEUIL ET SON APPLICATION A UN DISPOSITIF DE TRAITEMENT DE L'INFORMATIONMUKAI H; NAKASHIMA T; MATSUKURA Y et al.1973; N.E.C. RES. DEVELOP.; JAP.; DA. 1973; NO 28; PP. 110-136; BIBL. 20 REF.Serial Issue

140 GHz broadband crossbar stripline mixers with over 20 GHz instantaneous RF bandwidthNGUYEN, C; CHANG, K.Electronics Letters. 1984, Vol 20, Num 11, issn 0013-5194, 441Article

THERMAL ASPECTS OF ELECTRONIC PACKAGING1972; IN: INT. ELECTRON. PACKAG. PROD. BRIGHTON, ENGL., 1971. PROC. TECH. PROGRAMME; CHICAGO; IND. SCI. CONF. MANAGE.; DA. 1972; PP. 297-335; BIBL. DISSEM.Conference Proceedings